Tomshardware Premium
Deeper analysis. Exclusive features. Insider access. Tom’s Hardware Premium is the expert’s guide to tech.
-
PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
-
-
PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
-
PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
-

Access Bench to view a treasure trove of data and compare products
-

Leave your feedback on Tom's Hardware Premium
-
Premium Features
View all-
-
PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
By Jake Roach Published -
PremiumThe great Bench GPU retest begins — how we're testing for our GPU Hierarchy in 2026, and why upscaling and framegen are still out
By Jeffrey Kampman Published -
PremiumThe state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress
By Anton Shilov Published -
PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
By Brandon Hill Published -
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published
-
Roadmaps
View All-
-
PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
-
News Analysis
View all-
-
PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
By Luke James Published -
PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James Published -
PremiumInside Meta and AMD's $100 billion deal, and why AMD is giving up a slice of the company in return for GPU orders
By Sayem Ahmed Published -
PremiumSambanova introduces new AI accelerator, partners with Intel to deploy Xeon CPUs for inferencing and agentic workloads
By Anton Shilov Published -
PremiumAI boosted US economy by 'basically zero' in 2025, says Goldman Sachs chief economist
By Jon Martindale Published -
PremiumOpenAI couldn’t finance its data centers, so it took control of the hardware instead
By Luke James Published
-
Latest
-
-
PremiumChina’s CXMT and YMTC to memory output
By Luke James Published -
PremiumIntel is co-developing new Z-Angle Memory to compete with HBM used in AI data centers
By Jon Martindale Published -
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumApple concedes it is constrained by TSMC's supply of advanced chips; storage and memory are also in short supply
By Anton Shilov Published -

Samsung, SK Hynix, Micron team up to block memory hoarding
By Jon Martindale Published -
PremiumChina moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies
By Luke James Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published -
PremiumOngoing trade war has TSMC and Taiwan stuck between a rock and a hard place
By Bruno Ferreira Published -
PremiumASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom
By Anton Shilov Published -
PremiumSamsung's Taylor, Texas fab could herald a breakthrough for the chipmaker, company plans 2026 risk production
By Anton Shilov Published -
PremiumSK hynix invests $10 billion in creating a U.S.-based 'AI solutions' company
By Jon Martindale Published
-