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PremiumNvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch
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PremiumChip scarcity assaults auto industry amid the worsening Nexperia and DRAM crisis
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PremiumNvidia's focus on rack-scale AI systems is a portent for the year to come
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Chip scarcity assaults auto industry amid the worsening Nexperia and DRAM crisis
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PremiumA deeper look at the tightened chipmaking supply chain, and where it may be headed in 2026
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PremiumHere's why HBM is coming for your PC's RAM
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PremiumThe data center cooling state of play (2025) — Liquid cooling is on the rise as thermal density demands skyrocket in AI data centers
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PremiumSplave's Cave: Overclocking the Asus RTX 5090 Astral and setting the 3DMark Port Royal world record
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PremiumWhy copper markets are feeling the pinch due to aggressive AI data center expansion
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PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
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PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
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PremiumThe future of DRAM: From DDR5 advancements to future ICs
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PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
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News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
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PremiumInside the future of 3D NAND: The roadmap to 500 layers
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PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
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PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
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News AnalysisMicron details new U.S. fab projects — HBM production coming to America
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TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
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PremiumNvidia CEO Jensen Huang explains why SRAM isn't here to eat HBM's lunch
-
Premium
Nvidia's focus on rack-scale AI systems is a portent for the year to come
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PremiumChina’s GPU cloud consolidates around Baidu and Huawei as domestic AI chips scale up
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PremiumChina’s top chip foundries move to consolidate as Beijing pushes semiconductor self-sufficiency
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PremiumU.S. electricity grid stretches thin as data centers rush to turn on onsite generators
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PremiumMicron secures $318 million Taiwanese subsidy for HBM R&D as AI memory arms race intensifies
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Huawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
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Premium
Why copper markets are feeling the pinch due to aggressive AI data center expansion
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PremiumNexperia’s standoff puts a core part of the chip supply chain under strain
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PremiumNvidia’s $2B Synopsys stake strengthens its push into AI-accelerated chip design
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PremiumHBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E
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PremiumChina claims domestically-designed 14nm logic chips can rival Nvidia's 4nm
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PremiumGoogle TPUs garner attention as AI chip alternative, but are only a minor threat to Nvidia's dominance
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PremiumTaiwan's $3.2 billion plan for 'AI island' with data centers, quantum hubs and AI robotics labs faces risks
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PremiumTSMC's CoWoS packaging capacity reportedly stretched due to AI demand
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PremiumIBM and Cisco agree to lay the foundations for a quantum internet
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Huawei's Ascend AI chip ecosystem scales up as China pushes for semiconductor independence
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PremiumThe web's infrastructure has a concentration problem, exposing us all to crushing outages
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