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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
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PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
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Premium Features
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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
By Jake Roach Published -
PremiumThe great Bench GPU retest begins — how we're testing for our GPU Hierarchy in 2026, and why upscaling and framegen are still out
By Jeffrey Kampman Published -
PremiumThe state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress
By Anton Shilov Published -
PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
By Brandon Hill Published -
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published
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Roadmaps
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PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
By Luke James Published -
PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James Published -
PremiumInside Meta and AMD's $100 billion deal, and why AMD is giving up a slice of the company in return for GPU orders
By Sayem Ahmed Published -
PremiumSambanova introduces new AI accelerator, partners with Intel to deploy Xeon CPUs for inferencing and agentic workloads
By Anton Shilov Published -
PremiumAI boosted US economy by 'basically zero' in 2025, says Goldman Sachs chief economist
By Jon Martindale Published -
PremiumOpenAI couldn’t finance its data centers, so it took control of the hardware instead
By Luke James Published
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Latest
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PremiumSamsung introduces SOCAMM2 LPDDR5X memory module for AI data centers
By Luke James Published -
PremiumHere's why HBM is coming for your PC's RAM
By Luke James Published -
PremiumHuawei's AI chip capabilities still pale in comparison to American silicon
By Luke James Published -
PremiumKioxia's next-gen 3D NAND production gets expedited to 2026, report claims
By Anton Shilov Published -
PremiumNew 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
By Luke James Published -

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup
By Luke James Published -
PremiumThe data center cooling state of play (2025) — Liquid cooling is on the rise as thermal density demands skyrocket in AI data centers
By Anton Shilov Published -
PremiumAmazon unveils 192-core Graviton5 CPU with massive 180 MB L3 cache in tow
By Anton Shilov Published -
PremiumCambricon targets 500,000 AI chips in 2026 as China accelerates domestic hardware push
By Luke James Published -
PremiumMicrosoft, Google, OpenAI, and Anthropic join forces to form Agentic AI alliance, according to report
By Jon Martindale Published -
PremiumThe Nvidia H200 export saga, as it happened — Beijing ponders response and buyers line up
By Luke James Published -
PremiumMarvell’s $5.5B Celestial AI acquisition expands its role in AI data center hardware
By Luke James Published
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