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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
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PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
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Premium Features
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PremiumBehind the scenes of our massive CPU retest for Bench — testing at 1080p, choosing new apps, and gathering data for a decade of CPUs
By Jake Roach Published -
PremiumThe great Bench GPU retest begins — how we're testing for our GPU Hierarchy in 2026, and why upscaling and framegen are still out
By Jeffrey Kampman Published -
PremiumThe state of China's decade-long semiconductor push: still a decade behind, despite hundreds of billions spent and significant progress
By Anton Shilov Published -
PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
By Brandon Hill Published -
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published
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Roadmaps
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PremiumUALink roadmap plots course to optimized AI data center interconnects
By Anton Shilov Published -
PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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PremiumAmazon invests $50 billion in OpenAI, comitting to 2 gigawatts of Trainium silicon
By Luke James Published -
PremiumISSCC 2026: AMD discloses how the Instinct MI355X doubled per-CU throughput despite lower compute unit count
By Luke James Published -
PremiumInside Meta and AMD's $100 billion deal, and why AMD is giving up a slice of the company in return for GPU orders
By Sayem Ahmed Published -
PremiumSambanova introduces new AI accelerator, partners with Intel to deploy Xeon CPUs for inferencing and agentic workloads
By Anton Shilov Published -
PremiumAI boosted US economy by 'basically zero' in 2025, says Goldman Sachs chief economist
By Jon Martindale Published -
PremiumOpenAI couldn’t finance its data centers, so it took control of the hardware instead
By Luke James Published
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Latest
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SK hynix to build first U.S. packaging plant for HBM
By Luke James Published -
PremiumSoftBank stakes $4B on securing AI data center power and capacity
By Luke James Published -
PremiumTSMC's average wafer prices increased by over 15% each year since 2019, report suggests
By Anton Shilov Published -
PremiumNvidia's $20 billion Groq IP deal bolsters AI market domination
By Luke James Published -
PremiumNvidia reportedly backs away from its effort to make its own public cloud, team reorg eases friction with customers
By Luke James Published -

How China’s control of battery supply chains is becoming a critical risk for U.S. military power and AI initiatives
By Luke James Published -

China chipmaker SMIC raises wafer prices by about 10% as memory demand tightens capacity
By Luke James Published -
PremiumSK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers
By Luke James Published -
PremiumChina's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip
By Anton Shilov Published -

Former Chinese gaming company with China govt ties accused of smuggling banned AI GPUs
By Luke James Published -

Nvidia prepares shipment of 82,000 AI GPUs to China as chip war lines blur
By Luke James Published -
PremiumChinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines
By Luke James Published
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