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TSMC preps immersion lithography for sub-22nm wafer production

Having already commenced pilot runs on 65nm wafer production since last year, Taiwan Semiconductor Manufacturing Company (TSMC) is now readying immersion lithography for 22nm production, according to Burn Lin, director of lithography R&D at TSMC.

In order to shrink the size of ICs to bring performance advancements as well as further suppressing costs, lithography must be advanced to shorter light wavelengths.

More here at DigiTimes.