Latest about IFS
Intel Rolls Out 16nm Process Technology Tools: A Low-Cost, Low-Power FinFET Node
Intel introduces new process technology to address mobile, RF, IoT, consumer, storage and military, aerospace and government applications.
Intel Details PowerVia Backside Power Delivery Technology
Intel reveals the benefits of backside power delivery networks and how it achieved it. This technology will be a major benefit for the upcoming 20A and 18A manufacturing nodes.
Intel to Show Off E-Core-Based CPU with Backside Power Delivery
Intel to describe benefits of PowerVia backside PDN with 4nm-class test chip.
EU Proceeds with $47 Billion European Chips Act
The EU reaches a deal on local semiconductor industry funding, to the tune of €43 billion.
Intel Foundry and Arm to Collaborate on 1.8nm Mobile SoCs
Intel and Arm to cooperate on design technology co-optimization for Intel 18A node.
Intel's Acquisition of Tower Delayed, Still Expected to Close by June 2023
China's State Administration for Market Regulation still has not cleared Intel-Tower transaction.
Intel Appoints New Head for Foundry Business
Intel announced today that Stuart Pann will be the new head of its foundry business, and will attempt to accelerate its growth and rate of adoption by other customers.
U.S. Sanctions Against China Could Hurt Own Domestic Industry: SIA
As U.S.-based wafer fab equipment makers have to reduce headcount due to China business concerns, SIA addresses the U.S. government.