Intel
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Ultra Ethernet Consortium adds 45 new members in five months – aiming for version 1.0 to connect HPC and AI clusters this year
By Anton Shilov published
45 additional members join the Ultra Ethernet Consortium to enable next-generation connectivity for AI and HPC applications.
Intel and TSMC face chip fab construction delays and supplier woes in Arizona
By Anton Shilov published
Suppliers of chipmakers postpone or scale back their U.S. plants due to rising costs and uncertainties.
Intel pushes launch date of Ohio fab from 2025 to 2027 or 2028
By Mark Tyson published
Intel reports that its Ohio fab won't be operational until 3 years later than originally reported.
China filed 25% more patents than the U.S. in 2023 — heavily sanctioned Huawei led all companies
By Anton Shilov published
Huawei and China led WIPO's patent filers list in 2023 as they accelerated technology development.
NASA's old supercomputers are causing mission delays
By Anton Shilov published
NASA's supercomputing capabilities are insufficient for its tasks, leading to oversubscription and overburdening. An internal audit recommends transiting from CPUs to GPUs.
ASML delivers cutting-edge new chipmaking tool
By Anton Shilov published
ASML's Twinscan NXE:3800E speeds up wafer processing to up to 220 wafers per hour and can enable 2nm and thinner process nodes.
Intel's plan to postpone chip plant in Italy confirmed by the country's Industry Minister
By Mark Tyson published
A proposed R&D Center in France has also been shelved.
Delidded Core i9-14900KS PCs on sale with Intel approval and warranty - Maingear among first partners
By Mark Tyson published
Intel is working with select PC makers like Maingear to offer warranty-backed systems featuring delidded Core i9-14900KS processors.
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