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Taiwanese 'CHIPS Act'-Line law enacted
By Anton Shilov published
Taiwan is set to subsidize semiconductor-related R&D as well as production CapEx.
Micron displays next-gen LPCAMM2 modules for laptops at CES 2024
By Anton Shilov published
Micron showcases next-generation memory LPCAMM2 modules for laptops and small form-factor desktops.
Samsung develops low-latency, low-power DRAM with performance that allegedly eclipses DDR5
By Anton Shilov published
Samsung talks Low Latency Wide I/O (LLW) DRAM: 128 GB/s per module.
Micron unveils LPCAMM2 - bringing LPDDR5X to smaller form factor memory modules
By Anton Shilov published
Micron puts LPDDR5X memory into LPCAMM2 modules to reduce power consumption and increase the performance of modern laptops.
TSMC won't adopt advanced High-NA EUV chipmaking tools until 2030 or later
By Anton Shilov published
According to China Renaissance, TSMC might adopt High-NA EUV lithography for a post-1nm process technology in 2030 or later.
Intel receives first High-NA EUV chipmaking tool from ASML
By Anton Shilov published
Intel receives the first components of ASML's High-NA EUV scanner.
Samsung teases new Odyssey OLED monitors
By Roshan Ashraf Shaikh published
Samsung Electronics America has three Oddysey monitors ready to debut at CES 2024 - The OLED G6 model G60SD, the G8 model G80SD, and the G9 model G95SD.
Samsung plans to eliminate humans from its chip fabs by 2030
By Anton Shilov published
Samsung intends to make its chip fabs human-less by 2030, says report.
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