Latest about Samsung
UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets
UCIe specification reaches version 2.0, gets interoperability architecture for multi-vendor chiplets and 3D packaging support optimized for hybrid bonding and bump pitches.
Samsung mass produces 'world's thinnest' LPDDR5X
Samsung's new LPDDR5X uses 12nm technology to free up space in mobile devices.
4TB Samsung 990 Pro SSD hits 7 cents per GB — hot deal on best PCIe 4 drive
The 4TB Samsung 990 Pro is down to 7 cents per GB — the lowest price this fantastic SSD has been in some time.
Preliminary HBM4 specs point to major performance uplift for GPUs
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
Samsung Foundry to build 2nm processors with HBM for Japanese AI firm
Preferred Networks inks deal with Samsung Foundry to supply 2nm AI processors in 2.5D packaging.
Samsung workers in South Korea begin 3-day strike
Three days may become more if Samsung does not meet demands.
Samsung quietly launches 61.44TB SSD, talks about a 122.88TB model
Samsung unveils high-capacity PCIe 3D QLC-based BM1743 SSD for datacenter-grade read-intensive storage applications.
What is GDDR7 memory — everything you need to know about the upcoming graphics VRAM technology
What is GDDR7 memory, and when will we see it? We dig into the details of the upcoming VRAM technology and cover what it is, along with the benefits it provides.
