GlobalFoundries
Latest about GlobalFoundries

GlobalFoundries to expand New York fab — announces new $575 million advanced packaging and photonics facility
By Jowi Morales published
GlobalFoundries is investing around $575 million to construct an advanced packaging and silicon photonics facility at its Malta, New York site.

China investigates whether CHIPS and Science Act harms its chip companies
By Anton Shilov published
The Chinese Ministry of Commerce alleges that U.S. subsidies to semiconductor industry harm government-funded Chinese chipmakers.

IBM and GF settle chip tech lawsuits involving Intel and Rapidus
By Anton Shilov published
GlobalFoundries and IBM settle all litigations, including those that covered IBM's work with Intel and Rapidus.

GlobalFoundries gets $1.5 billion subsidy from U.S. gov't after it was fined for violating export laws to China
By Anton Shilov published
GlobalFoundries signed a deal to get $1.5 billion under the CHIPS and Science Act even after being fined for violating U.S. export laws by supplying advanced chips to Chinese entities.

Chipmakers race to get CHIPS Act dollars before White House changeover — TSMC and GlobalFoundries finalize applications, facilitating payouts
By Anton Shilov published
GlobalFoundries and TSMC finalize talks with the U.S. government to get CHIPS Act funding.

GlobalFoundries fined $500,000 for restricted chip exports to Chinese firm on U.S. entity list
By Kunal Khullar published
GlobalFoundries is said to have shipped 74 orders, totaling $17.1 million, to SJ Semiconductor, a SMIC affiliate, without obtaining the required license.

GlobalFoundries helps pay off student loans to retain and attract semiconductor talent
By Anton Shilov published
GlobalFoundries program offers up to $28,500 in loan repayment for enrolling students.

U.S. enacts law to exempt select fabs from environmental reviews
By Anton Shilov published
U.S. government streamlines fab projects by easing fab permits

UCIe 2.0 specifications standardize management architecture and 3D packaging across different chiplets
By Anton Shilov published
UCIe specification reaches version 2.0, gets interoperability architecture for multi-vendor chiplets and 3D packaging support optimized for hybrid bonding and bump pitches.
Stay On the Cutting Edge: Get the Tom's Hardware Newsletter
Get Tom's Hardware's best news and in-depth reviews, straight to your inbox.