IBM to fab next-gen VIA CPU
News
By
Wolfgang Gruener
published
VIA will use IBM's 300mm East Fishkill wafer fab - the foundry already used to punch out CPUs for Apple and Nvidia, and soon Microsoft and Sony - to produce the next generation of its x86 processor family.
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Wolfgang Gruener is an experienced professional in digital strategy and content, specializing in web strategy, content architecture, user experience, and applying AI in content operations within the insurtech industry. His previous roles include Director, Digital Strategy and Content Experience at American Eagle, Managing Editor at TG Daily, and contributing to publications like Tom's Guide and Tom's Hardware.