VIA will use IBM's 300mm East Fishkill wafer fab - the foundry already used to punch out CPUs for Apple and Nvidia, and soon Microsoft and Sony - to produce the next generation of its x86 processor family.
Read the complete story here.
VIA will use IBM's 300mm East Fishkill wafer fab - the foundry already used to punch out CPUs for Apple and Nvidia, and soon Microsoft and Sony - to produce the next generation of its x86 processor family.
Read the complete story here.
