DDR4 is expected to be shipping in volume in 2014, but Micron believes that it will enter volume production in the fourth quarter of this year and have the chips ready for applications in early 2013.
The modules were developed in collaboration with Nanya and manufactured as a the 4 Gb DDR4 x8 part in a 30 nm process. When in production, Micron says it will be offering RDIMMs, LRDIMMs, 3DS, SODIMMs and UDIMMs in standard and ECC versions. Initial speeds of the devices will reach 2,400 MT/s and eventually hit 3,200 MT/s.
"With the JEDEC definition for DDR4 very near finalization, we've put significant effort into ensuring that our first DDR4 product is as JEDEC-compatible as it can be at this final stage of its development," said Brian Shirley, vice president for Micron's DRAM Solutions Group, in a prepared statement. "We've provided samples to key partners in the market place with confidence that the die we give them now is the same die we will take into mass production."
Micron's roadmap looks especially interesting in the light of its planned acquisition of Elpida Memory, which could boost its DRAM market share to an estimated 25 percent, according to market research firm IHS. The company could grow into a serious competitor for Samsung, which announced the first DDR4 module in January 2011.
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