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GPUs and CPUs are built from semiconductors, which power everything from PCs and data centers to cars, lightbulbs, refrigerators, and more. And they’ll power the next generation of tech and the AI that’s poised to change the world. Billions of dollars and the world economy is at stake -- and with a deeper dive and more insight than anyone else, Tom's Hardware is your expert guide to this dynamic world. Here's what we're covering right now:
- TSMC Arizona The rebirth of US manufacturing?
- Meteor Lake a fundamental rethink of Intel’s chip design
- The CHIPS Act $52.7 billion in incentives. Here's where it went
- Supercomputers The fastest, most powerful computers in the world
- Chip War A global fight for control of semiconductors
- Artificial Intelligence Will machine learning change everything?
Latest News

Germany vows to subsidize Intel and TSMC fabs despite budget crisis
By Anton Shilov published
Germany vows to subsidize Intel and TSMC fabs despite a budget crisis, though Intel and Wolfspeed reportedly received firm fab funding commitments from the German government.

Ericsson processors built on 'Intel 4' process node beat Meteor Lake to market
By Matthew Connatser published
IDM 2.0 is finally getting somewhere.

Microsoft's 2023 ugly sweater lets you wear the famous Windows XP wallpaper
By Andrew E. Freedman published
Microsoft's new ugly sweater for the holidays features the "Bliss" wallpaper from Windows XP

AMD Ryzen 8040HS Hawk Point CPU benchmarks show minor gains
By Zhiye Liu published
AMD's Ryzen 8040HS (Hawk Point) processors break cover with the first benchmark leaks, showing minor gains over 7040HS (Phoenix Point). The future CPUs are destined to fight Intel's Meteor Lake CPUs.

Repurposed blower-style RTX 3080 with 20GB GDDR6X memory spotted
By Roshan Shaikh published
A lot of these are probably old mining cards.

Intel Arrow Lake-H 'leaked' in customs database
By Matthew Connatser published
A customs and shipping database revealed an engineering sample of an Arrow Lake-H CPU sporting 14 cores with integrated graphics, presumably a midrange SKU.

SK Hynix announces revolutionary fan-out packaging for memory
By Anton Shilov published
SK Hynix readies 2.5D fan-out packaging for next-gen memory that combines wide I/O with low costs and eliminates TSVs.

New Chinese Loongsoon chip matches Intel's 14600K in IPC tests
By Mark Tyson published
Loongson’s 3A6000 CPU is ready for prime time, and it has announced PC partners including a new Asus motherboard. The Chinese chip’s performance is similar to Intel’s Core i3-10100 CPU.
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