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Latest News

DJI sues the FTC over its prohibition on importing new models of foreign-made drones into the U.S.
By Hassam Nasir published
Another legal battle for survival comes DJI's way.

Nvidia's N1/N1X SoCs tipped for release in first half of 2026, debuting on Dell & Lenovo laptops
By Hassam Nasir published
N1 silicon is finally right around the corner.

US gov't warned Nvidia CEO Jensen Huang, Tim Cook, and Lisa Su that China could invade Taiwan by 2027
By Zak Killian published
A new report reveals that tech CEOs were cautioned in 2023, yet haven't really taken action on the info.

Qualcomm's 2019-vintage AI100 chip finally scores a major deployment
By Bruno Ferreira published
Qualcomm's 2019-vintage AI100 chip finally scores a major deployment

ATABoy bridges old IDE drives to the 21st century with Open Source USB host bridge
By Les Pounder published
Using the power of the Raspberry Pi Pico 2's RP2350, ATAboy bridges the hard drives of old, with the computers of today.

Ambitious developer showcases slick triple-level Quake-like game stored in tiny 64KB executable
By Mark Tyson published
Developer Daivuk has released QUOD, a 64KB ‘boomer shooter’ with an uncanny resemblance to id Software’s seminal FPS title, Quake.

Apple to produce Mac Minis in Houston for the first time
By Luke James published
Apple announced that it will begin producing the Mac Mini in Houston, Texas later this year, marking the first time that the compact desktop has ever been manufactured in the United States.

AMD and Meta strike $100 billion AI deal that includes 10% stock deal
By Stephen Warwick published
AMD and Meta have announced an AI chips deal thought to be worth more than $100 billion.

AI tool OpenClaw wipes the inbox of Meta's AI Alignment director despite repeated commands to stop
By Bruno Ferreira published
Meta's AI Director of Alignment asked OpenClaw to clean up her inbox, only for the AI agent to nuke everything inside.

ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
By Anton Shilov published
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
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