Bloomberg reports that Samsung is completely giving up on using the Snapdragon 810 in its Galaxy S6 flagship device.
Intel increased its revenue and profit in 2013, but the mobile division experienced a significant $4 billion loss, showcasing Intel's difficulties in the mobile market.
South Korean sources keep insisting that Qualcomm is facing overheating issues with the Snapdragon 810, which could lead to a delay that would help its competitors.
Tegra X1's 256-core Maxwell GPU and 8-core big.LITTLE CPU bring greater performance and efficiency to mobile.
TSMC will remain Apple's main supplier for A9 chips, with Samsung acting as backup supplier. In the meantime, TSMC faces continued pressure from Chinese foundries.
Samsung's 14nm FinFET production has started, which means we could be only six months away until we see 14nm chips shipping in mobile devices or smartwatches.
Qualcomm announces Cat. 9 LTE support for its Snapdragon 810 chip, days after rumors said that Samsung's next-generation Exynos SoC will come with Cat. 10 LTE.
A spokesperson for Qualcomm said the layoffs are not related to ongoing investigations of the company by the U.S., China, and the European Union.
Samsung is working on its own Cat10 LTE modem, which may even beat Qualcomm's Cat10 modem to market.
Samsung is working on GPU technology that may be inside the Galaxy Note 5 along with its own custom CPU core.
Imagination and SELTECH have worked together to support the FEXEROX hypervisors on MIPS microcontrollers to enable increased security for embedded systems.
Intrinsyc launches a "Qualcomm Mobile Development Platform Smartphone" for $800. Developers can now start to optimize their apps for Qualcomm's 64-bit chip.
Three theories for the merger of Intel's mobile and PC businesses: hiding losses, manufacturing synergy and the (eventual) discarding of the mobile chips.
Marvell begins the assault on Mediatek with two 64-bit chips that also come with integrated LTE modems.
TSMC reached the risk production milestone with its second generation FinFET-based process, the 16FF+. Mass production of chips based on this process is expected to begin mid-2015.