Tokyo - Elpida today announced that it will begin mass-production of Fully Buffered Dual In-Line Memory Modules in the fourth quarter of this year, providing enough supply for Intel's next-generation dual-core workstation and server platforms scheduled to launch in Q1 of 2006.
Elpida is the first large memory manufacturer to announce that it is moving from sampling into a volume production phase for FB memory modules. Aimed at the workstation and server environment, the technology promises higher density, more capacity and increased speed.
The FB-DIMMs technology foundation is common DDR2 SDRAM, but features a revised module design. All signals (clock, address, command and data) to and from the DRAM on the module are buffered at the high-speed advanced memory buffer (AMB) chip located on the DIMM. This helps to secure the DRAM timing margins during high-speed operation with a much shorter signal path between the DRAM and the AMB, Elpida said. The FB-DIMM also adopts a Point-to-Point connection on the bus between the memory controller and the DIMM, as well as between the DIMMs, which enables increased bus speed with a shorter connection path.
The company is offering FB-DIMMS in a 4 GByte version, based either on DDR2-533 (CL 4-4-4) or DDR2-667 (CL 5-5-5), which allows customers to equip a common eight-slot server with up to 32 GByte of memory. Data transfer speeds will reach 21.2 GByte per second, Elpida said.
The announced FB-DIMMs are based on 36 1 Gigabit memory devices that are built into stacked FBGA (sFBGA) packages to enable thinner modules to improve airflow and cooling performance inside of casings: Elpida said its FB-DIMMs measure 6.7 mm and are well below the JEDEC specification of a maximum of 9.8 mm.
Elpida currently sells its 4 GByte FB-DIMMs in sample numbers for $3000 (533) and $3500 (667) each. Devices with lower densities and 2 GByte, 1 GByte and 512 MByte capacities are available as well.
One of the first platforms supporting FB-DIMMs is Intel's current 945/955 (Lakeport) chipset series which is offered for the Pentium D 800 (Smithfield) processor series. The company will introduce FB-DIMM support for its Xeon processors with the arrival of the dual-core generation in the first quarter of next year. The upcoming Xeon DP platform, code-named Bensley, will use FB-DIMMs in conjunction with the Xeon DP 5000 (Dempsey-core) processor and Greencreek and Blackford chipsets. The Xeon MP's current Truland platform will be carried over to the dual-core Xeon MP 7000, code-named Paxville. Truland will be FB-DIMM capable with the launch of the E8501 chipset in Q1 2006.
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Wolfgang Gruener is an experienced professional in digital strategy and content, specializing in web strategy, content architecture, user experience, and applying AI in content operations within the insurtech industry. His previous roles include Director, Digital Strategy and Content Experience at American Eagle, Managing Editor at TG Daily, and contributing to publications like Tom's Guide and Tom's Hardware.
