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PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
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PremiumIBM triples entry-level hires for 2026 despite AI adoption, bucking industry trends
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PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
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Premium Features
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PremiumWi-Fi 7 promises made, but not kept — the mysteries of MLO and AFC, and looking toward Wi-Fi 8
By Brandon Hill Published -
PremiumUltra Ethernet: The data-center interconnection of tomorrow detailed
By Anton Shilov Published -
PremiumCPU scaling with DLSS
By Jake Roach Published -
PremiumPhotonics and high-speed data movement is the next big AI bottleneck
By Chris Stokel-Walker Published -
PremiumThe Stout Owl: How I Built the Ultimate Noctua G2 PC
By Niels Broekhuijsen Published -
PremiumAMD CES 2026 gaming trends press Q&A roundtable transcript — 'we see a little bit of an uptick in the percentage of AM4 versus AM5 platforms'
By Zak Killian Published
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Roadmaps
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PremiumThe future of Quantum computing — the tech, companies, and roadmaps that map out a coherent quantum future
By Francisco Pires Published -
PremiumHuawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov Published -
PremiumInside the AI accelerator arms race: AMD, Nvidia, and hyperscalers commit to annual releases through the decade
By Anton Shilov Published -
PremiumThe future of DRAM: From DDR5 advancements to future ICs
By Anton Shilov Published -
PremiumDesktop GPU roadmap: Nvidia Rubin, AMD UDNA & Intel Xe3 Celestial
By Hassam Nasir Published -
News AnalysisSilicon Motion announces new devices: PCIe 6.0 SSDs, 256 / 512 TB drives, and next-gen 16K LDPC
By Anton Shilov Published -
PremiumHBM roadmaps for Micron, Samsung, and SK hynix: To HBM4 and beyond
By Anton Shilov Published -
PremiumInside the future of 3D NAND: The roadmap to 500 layers
By Anton Shilov Published -
PremiumNvidia enterprise GPU and CPU roadmaps: Rubin, Rubin Ultra, Feynman, and silicon photonics
By Anton Shilov Published -
News AnalysisMicron details new U.S. fab projects — HBM production coming to America
By Anton Shilov Published -

TSMC to spend $42 billion on expansion in 2025 — ambitious plans detail nine production facilities
By Anton Shilov Published
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News Analysis
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PremiumIBM triples entry-level hires for 2026 despite AI adoption, bucking industry trends
By Jon Martindale Published -
PremiumRapidus targets mass 2nm chip production in 2027, quadruples capacity ramp up — company plans to scale to 25,000 wafer starts per month in just one year
By Luke James Published -
PremiumGoogle reports that state hackers from China, Russia and Iran are using Gemini in 'all stages' of attacks
By Jon Martindale Published -
PremiumCadence embeds AI 'super agent' to assist engineers when designing EDA tools
By Luke James Published -
PremiumMontage's strong IPO highlights Chinese investment rush into AI and data center ecosystems
By Anton Shilov Published -
PremiumUsing AI actually increases burnout despite productivity improvements, study shows
By Jon Martindale Published
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Latest
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China chipmaker SMIC raises wafer prices by about 10% as memory demand tightens capacity
By Luke James Published -
PremiumSK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers
By Luke James Published -
PremiumChina's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip
By Anton Shilov Published -

Former Chinese gaming company with China govt ties accused of smuggling banned AI GPUs
By Luke James Published -

Nvidia prepares shipment of 82,000 AI GPUs to China as chip war lines blur
By Luke James Published -
PremiumChinese fabs are reportedly upgrading older ASML DUV lithography chipmaking machines
By Luke James Published -
PremiumSamsung introduces SOCAMM2 LPDDR5X memory module for AI data centers
By Luke James Published -
PremiumHere's why HBM is coming for your PC's RAM
By Luke James Published -
PremiumHuawei's AI chip capabilities still pale in comparison to American silicon
By Luke James Published -
PremiumKioxia's next-gen 3D NAND production gets expedited to 2026, report claims
By Anton Shilov Published -
PremiumNew 1.4nm nanoimprint lithography template could reduce the need for EUV steps in advanced process nodes
By Luke James Published -

Qualcomm’s Ventana acquisition points to a long-term RISC-V strategy to complement its Arm lineup
By Luke James Published
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