Latest about SK Hynix
Samsung HBM3E chips reportedly fail to meet Nvidia's heat and power requirements
Samsung's HBM3E reportedly consumes too much power and overheats, so Nvidia does not plan to use them for now.
$19 billion support package unveiled for South Korean semiconductor industry
New support package for South Korean semiconductor industry aims to improve chip design and contract chip production in the country.
TSMC to build base dies for HBM4 memory on its 12nm and 5nm nodes
TSMC to use 12FFC+ and N5 process technologies to build base dies for HBM4.
Samsung and SK hynix abandon DDR3 production to focus on unrelenting demand for HBM3
Jettisoning less profitable DDR3 production lines.
U.S. to triple overall chip production by 2032, but still remain world's fifth-largest supplier
SIA expects U.S. semiconductor production capacities to grow at the highest pace in the world thanks to CHIPS and Science Act.
Global chip materials market declined in 2023 — China is the only country to experience growth
The global semiconductor materials market contracted to $66.7 billion in 2023.
Explosive HBM demand fueling an expected 20% increase in DDR5 memory pricing — demand for AI GPUs drives production cuts for standard PC memory
As demand for high bandwidth memory increases, DRAM prices are poised to go up, too, as chipmakers shift priorities to HBM production for AI GPUs.
Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.
