SK Hynix

Latest about SK Hynix

Micron
U.S. imposes 25% tariffs on all products from Japan and South Korea

By Anton Shilov Published

They'll take effect from August 1

Tech Industry
Micron
New US restrictions could prevent leading chip manufacturers from installing chipmaking tools in their China fabs

By Anton Shilov Published

The U.S. government may cancel a program for multinational chipmakers, with impacts to firms like Samsung, SK hynix, and TSMC which operate in China.

Tech Industry
Micron's HBM4
Micron starts to ship samples of HBM4 memory to clients — 36 GB capacity and bandwidth of 2 TB/s

By Anton Shilov Published

Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.

DRAM
TSMC
CHIPS Act beneficiaries 'mired in NIMBY fights and two-year permits'

By Anton Shilov Published

An expensive delay

Semiconductors
CXMT DRAM facility render image
DDR4 prices continue to surge

By Mark Tyson Published

'Rapid spike' in DDR4 spot pricing precipitated by manufacturer phase out plans, US-China tensions, and market uncertainties.

DDR4
SK hynix's speedy 1TB Tube flash drive is down to $59, an all-time low

By Stewart Bendle Published

SK hynix Tube T31 is an M.2 SSD on a USB-A stick with the best performance for a USB-A drive.

USB Flash Drives
Next gen UFS 4.1 flash
SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers

By Mark Tyson Published

News Analysis SK hynix today announced that it has developed a UFS 4.1 storage solution built upon 321-layer 4D NAND flash.

News Analysis
Tech Deals
SK hynix's superb 2TB P41 Gen 4 SSD is now just $124 for Memorial Day

By Stewart Bendle Published

Deals Grab 2TBs of SSD goodness with this SK hynix deal for $124 in Newegg's Memorial Day sales.

Deals
Incheon International Airport
Suspected SK hynix HBM tech leaker arrested boarding flight to China

By Mark Tyson Published

A man suspected of attempting to smuggle SK hynix tech secrets to China was apprehended at South Korea’s Incheon International Airport earlier this month

Semiconductors
null
Samsung to adopt hybrid bonding for HBM4 memory

By Anton Shilov Published

News Analysis Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.

News Analysis
1 2 3 4 5 6 7 8 9 Archives