Latest about SK Hynix
Sandisk and other key suppliers of 3D NAND are projected to significantly increase prices of enterprise-grade 3D NAND memory in the coming months due to overwhelming demand from the AI sector.
The U.S. is playing it safe when it comes to chipmaking tools entering China.
SK hynix is bringing its HBM ambitions to U.S. soil with a $3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana.
The U.S. government has approved annual export licenses allowing Samsung Electronics and SK hynix to ship chipmaking equipment to their manufacturing facilities in China throughout 2026.
Premium SK hynix is expanding its U.S. presence with a new office in the Seattle metropolitan area, placing the world’s leading HBM supplier within minutes of Nvidia, Amazon, and Microsoft.
Premium Surging prices, diverted wafer capacity, and multi-year delays in relief are pushing memory out of reach for consumers.
SK hynix first to validate 32Gb-based 256GB DDR5 module with Intel: up to 32.4W power savings per server, or millions of dollars per hyperscale data center.
A growing body of forecasts from AMD, Nvidia, Broadcom, and major research firms now points toward a semiconductor market that passes the trillion-dollar threshold before the decade closes.
