Latest about SK Hynix
Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.
SK hynix is teasing 300TB SSDs as it pushes into AI
SK hynix announces a list of products for various applications featuring AI, including 300TB SSD, HBM4, LPDDR6, and CXL solutions.
HBM supply from SK hynix and Micron sold out until late 2025
SK hynix chief executive says the company's HBM supply is sold out for 2024, most 2024. Just like Micron's.
Memory makers reportedly stop publishing contract DRAM prices following Taiwan earthquake
DRAM makers expected to increase memory prices following April 3 earthquake near Taiwan.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
US urges South Korea to join the China sanctions regime, adjust export controls to prevent the country from getting chipmaking tools
The U.S. hopes to patch another China semiconductor industry loophole.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.