China's second-largest foundry hires former Intel executive to lead advanced node development

HLMC
(Image credit: HLMC)

Hua Hong Semiconductor, China's second-largest chip foundry, has made strategic leadership changes to prioritize logic chip production and develop more advanced process technologies. The company hired Bai Peng, a veteran in logic chip technology, and appointed him president on January 1, 2024, reports Nikkei

Bai Peng, who spent over three decades at Intel and led logic chip development from research to mass production, is expected to steer Hua Hong's shift toward advanced semiconductor production technologies. Hua Hong are one of China's few foundries to offer 40nm fabrication process along with SMIC. While 40nm is a fairly sophisticated technology, it cannot enable modern processors for AI, HPC, and client computing applications. The task for Bai Peng will be to advance Hua Hong's manufacturing processes. The report says that Bai's expertise aligns with the company's focus to develop fabrication nodes essential for AI and other high-end applications. 

The parent company, Huahong Group, has also undergone leadership changes. Tang Junjun, previously president, was promoted to chairman. Tang brings extensive experience from his tenure at a joint venture between Huahong Group and NEC. Additionally, Qin Jian, who led Shanghai Alliance Investment — a significant Hua Hong shareholder — became the parent group’s chairman in December 2023. 

Anton Shilov
Contributing Writer

Anton Shilov is a contributing writer at Tom’s Hardware. Over the past couple of decades, he has covered everything from CPUs and GPUs to supercomputers and from modern process technologies and latest fab tools to high-tech industry trends.