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Laser cutting and engraving from a software perspective
By Mark Tyson published
We take a closer look at the software side of laser cutting and engraving.

A deeper look at the tightened chipmaking supply chain, and where it may be headed in 2026
By Chris Stokel-Walker published
Premium We interview two industry analysts to gauge the current state of the chipmaking ecosystem, including constraints across the entire supply chain, and where it might be headed next.

Better safety features make laser engravers more popular than ever - a guide to the ins and outs of laser engraving and cutting
By Denise Bertacchi published
Upgraded safety systems make modern lasers easier to trust and easier to recommend.

Intel Core i7-14700K vs Intel Core Ultra 7 265K Faceoff
By Hassam Nasir published
Raptor Lake vs Arrow Lake Clash!

The USB Power Delivery (PD) Specification — everything you need to know about USB-PD
By Les Pounder published
Learn the secrets of the USB PD specification as we delve into how the specification has changed in over a decade of revisions

Here's why HBM is coming for your PC's RAM
By Luke James published
Premium Surging prices, diverted wafer capacity, and multi-year delays in relief are pushing memory out of reach for consumers.

Splave's Cave: Overclocking the Asus RTX 5090 Astral and setting the 3DMark Port Royal world record
By Allen 'Splave' Golibersuch published
Premium Overclocker Splave documents the trials and tribulations of overclocking the RTX 5090 Astral from Asus, resulting in a 3DMark world record.

Huawei Ascend NPU roadmap examined — company targets 4 ZettaFLOPS FP4 performance by 2028, amid manufacturing constraints
By Anton Shilov published
Premium Huawei eyes up extreme system-level scaling.
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