Plextor M8Se NVMe SSD Review By Chris Ramseyer Not yet rated NVMe continues to gain ground on SATA. The technology promises to increase performance and reduce costs, but the ecosystem isn't fully implemented.
Up To 8TB Of SSDs In RAID 0: Highpoint Ultimate Acceleration Drive SSD7100, First Look By Chris Ramseyer
Maxiotek MK8115 DRAMless Controller Preview By Chris Ramseyer Today we test a pair of early Maxiotek reference design SSD with Micron's 16nm and new 3D TLC using the MK8115 DRAMless controller.
Sk Hynix Begins Mass Production Of 72-Layer NAND By Chris Ramseyer Sk Hynix begins mass production of new 72-layer 3D NAND with 256Gbit capacity. The new memory will ship in a range of products including mobile, IoT, eMMC, and SSDs.
HP S700 Pro SSD Review By Chris Ramseyer Not yet rated HP is a name we know and trust. The company's Z Turbo SSD series gained the most recognition, but HP also has more traditional 2.5" SSDs.
Samsung Begins Shipping NAND From New Pyeongtaek Fab By Chris Ramseyer Samsung's new Pyeongtaek campus semiconductor fabrication line in South Korea begins shipping 4th generation NAND with 64-layers.
SK Hynix SC308 SSD Review By Chris Ramseyer Not yet rated SK Hynix had a great 2016 with a pair of excellent consumer SSDs. The SC308 looks to keep the streak alive with its multi-level cell (MLC) NAND at TLC pricing.
LaCie 5big & 8big Rack Thunderbolt 2 Review By Chris Ramseyer Not yet rated We're testing two of LaCie's flagship Thunderbolt 2 models that pack a hefty amount of storage capacity in a small package.
Intel SSD 545s Review By Chris Ramseyer Not yet rated Intel's 545s is the first consumer drive with IMFT's new 64-layer 3D NAND. All eyes are on Intel to see if the 545s can run with the 850 EVO.
Samsung Increases 64-Layer V-NAND Production By Chris Ramseyer Samsung ramps up 64-layer V-NAND flash production and prepares new memory products for the second half of 2017.
Phison Optimizes E8 For 3D TLC, Intros First Thunderbolt 3 External NVMe By Chris Ramseyer Phison showed two reference designs at Computex 2017, one for inside the PC and one for the outside. The success of the S10 and E7 gave the company confidence to engineer outside the box.
