Toshiba said last week that it began sampling out new 64 GB embedded NAND flash memory modules packed with a UFS interface (I/F). Designed for a wide range of small form factor products like smartphones and tablets, the new module is fully compliant with the JEDEC UFS v1.1 standard and supports the use of "lanes".
"The JEDEC UFS Ver.1.1 compliant interface handles essential functions, including writing block management, error correction and driver software," Toshiba said. "It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products."
The company said the new modules are sealed in a small FBGA package measuring a mere 12- x 16- x 1.2-mm and uses 169 balls. Voltage ranges from 2.7V to 3.6V for the memory core, 1.7V to 1.95V for the controller core, and 1.10V to 1.30V for the UFS interface signals.
The UFS serial interface has scalability the in number of lanes and speed. Toshiba's new modules offer single upstream and downstream lanes with 2.9 Gbit/sec bandwidth. Samples now shipping are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors.
"Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity," the company said. "Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to support samples with a 64GB UFS module."
Commercialization will depend on how receptive OEMs will be with these new chips using the UFS standard, so stay tuned.