Latest about HBM
Huawei backs HBM memory manufacturing in China to sidestep crippling US sanctions
Huawei is reportedly behind CXMT's development of HBM memory.
SK hynix confirms it will bring next-gen HBM manufacturing to the US — $3.87 billion memory fab to be built in Indiana
SK hynix selects Indiana for its first HBM packaging fab in the USA.
SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana
Indiana chips and Indiana nights, starting in 2028.
Micron says high bandwidth memory is sold out for 2024 and most of 2025
Nvidia buys Micron's HBM3E supply for calendar 2024 and 2025.
TSMC and SK Hynix team up for HBM4 co-production: Report
TSMC and SK Hynix reportedly join forces to build products for AI, including HBM4 memory.
SK Hynix announces revolutionary fan-out packaging for memory
SK Hynix readies 2.5D fan-out packaging for next-gen memory that combines wide I/O with low costs and eliminates TSVs.
SK Hynix plans a radical GPU redesign that 3D-stacks memory directly on processing cores
SK Hynix hires logic production specialists to integrate HBM4 memory directly on logic.
The Future of HBM Is Lightspeed - Designs of the Future to Integrate Photonics
High Bandwidth Memory's future looks... bright.
