HBM

Micron has become the first DRAM vendor to begin sampling 36GB HBM4 memory with a 2048-bit interface and 2TB/s bandwidth.

SoftBank wants to corner the AI chip memory market with a more efficient substitute to HBM.

Future AI accelerators for China will not use the Hopper architecture, as Jensen Huang hints at a potential switch to Blackwell.

With demand surging across multiple sectors, the U.S. memory giant is adjusting prices to match the tightening supply.

Micron's 1γ fabrication technology with EUV, new HKMG, and BEOL promises to increase performance while cutting power consumption for DRAM.

SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.

Tongfu Microelectronics joins CXMT and Wuhan Xinxin in HBM production for Chinese developers of AI processors.

Sales of AI memory solutions, including HBM3 and eSSDs, drove SK hynix's revenues and profits to record levels.

The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance