Latest about hbm
SK hynix to showcase 16-layer HBM3E, 122TB enterprise SSD, LPCAMM2, and more at CES
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance
Micron invests $7 billion in HBM assembly facility amid AI boom
Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.
US to reportedly sanction 200 more Chinese chip firms — high bandwidth memory might also see export bans
The latest round of US sanctions imposes tighter control over the export of US technology to 200 more chip makers in China.
Nvidia asked SK hynix to accelerate HBM4 chip delivery by six months, says report
SK hynix to deliver HBM4 memory to Nvidia about half of a year ahead of planned schedule.
SK hynix preps for Nvidia Blackwell Ultra and AMD Instinct MI325X with 12-Hi HBM3E
SK hynix kicks off mass production of 12-Hi HBM3E for AMD's MI 325X, Nvidia's Blackwell Ultra, other high-performance processors.
Rambus announces HBM4 memory controller for AI GPUs
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?
Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
