Latest about HBM
Rambus announces HBM4 memory controller for AI GPUs
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?
Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.
SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
Ampere unveils monstrous 512-core AmpereOne Aurora processor — custom AI engine, support for HBM memory
Ampere is adding a 512-core AmpereOne Aurora processor to its roadmap, and it also divulged pricing for its AmpereOne lineup.
Preliminary HBM4 specs point to major performance uplift for GPUs
JEDEC publishes initial specifications for HBM4: up to 1.64 TB/s per stack, loads of configurations.
Chinese memory maker gets $2.4 billion to build HBM for AI processors — Shanghai packaging facility to open in 2026
CXMT to invest $2.4 billion to build advanced packaging fab to build HBM memory for AI.
Micron to expand production of HBM3E memory across the world to increase HBM market share: Report
Nikkei says that Micron is set to produce more HBM3E memory in Taiwan, expand R&D operations in the U.S. and even start producing HBM3E memory in Malaysia.
Samsung and SK hynix abandon DDR3 production to focus on unrelenting demand for HBM3
Jettisoning less profitable DDR3 production lines.