Huawei
Latest about Huawei

TSMC ends contract with Singapore-based company over alleged Huawei ties
By Anton Shilov published
No more ties over Asced 910 guys.

China starts Big Fund III spending: $47 billion for ecosystem and fab tools
By Anton Shilov published
China gathers $47.5 billion to boost its chipmaking tools industry and ecosystem.

Huawei’s 1TB SSD shows up in South Korea for just $32
By Matthew Connatser published
The first consumer-grade SSDs from Huawei are finally on store shelves and for a low price, at least in South Korea.

US gov't set to ban Huawei intermediary Sophgo over AI chip supplies — partnership skirted US chip sanctions
By Anton Shilov published
U.S. to ban Sophgo, which supplied AI chiplets to Huawei, but its affiliate Bitmain avoids sanctions.

Huawei sticks to 7nm for latest processor as China's chip advancements stall
By Anton Shilov published
Huawei reportedly decided not to use its 5nm and 6nm process technologies for its latest smartphone processor.

U.S. House set to vote on $3B funding for the replacement of Chinese telecoms equipment
By Jowi Morales published
The U.S. will decide this week if it will allocate $3 billion to finally flush Huawei and ZTE from its telecommunications network.

Huawei preps new Kunpeng CPU with HBM
By Hassam Nasir published
HiSilicon is reportedly preparing a new Arm-based Kunpeng server chip featuring High Bandwidth Memory (HBM).

Chinese companies are reportedly reluctant to adopt homegrown chips
By Anton Shilov published
Chinese companies are reluctant to adopt domestic silicon from automotive and computing to AI and HPC sectors.

US lawmakers fire back at government's chip sanctions against China, alleging glaring loopholes that let China access the latest technology
By Anton Shilov published
Some loopholes are patched, others are not.

Chinese companies poach staff from ASML and Zeiss with three times higher pay — employees needed to design and build chipmaking tools amid sanctions
By Anton Shilov published
Chinese companies aggressively recruiting personnel from ASML and Zeiss to build their own wafer fabbing equipment.
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