Tsinghua Unigroup
Latest about Tsinghua Unigroup
U.S. Mulling Crackdown on China's 3D NAND Production
By Anton Shilov published
U.S. government targets YMTC, Samsung, SK Hynix to protect American 3D NAND makers.
YMTC's New In-House Controllers to Power PCIe 4.0 SSDs
By Anton Shilov published
YMTC validates its in-house developed PCIe 4.0 SSD controllers, becomes a vertically integrated SSD designer.
Apple Mulls Using 3D NAND from Chinese Supplier YMTC
By Anton Shilov published
Apple's Macs, iPhones, and iPads may start using YMTC's 3D NAND.
Researchers Develop Sidewall Transistor With Atom-Thick Features
By Francisco Pires published
"Sidewall" transistors could ultimately prove less complex and more efficient than other options.
Tsinghua Scraps 3D NAND and DRAM Fabs: May Affect Memory Prices
By Anton Shilov published
Tsinghua restructuring looks like a major setback for Chinese semiconductor industry.
Owner of China's Only 3D NAND Maker Faces Bankruptcy
By Anton Shilov published
With over $30 billion in debt, Tsinghua Unigroup may be restructured.
CXMT Becomes First Chinese DRAM Maker to Complete Fab
By Lucian Armasu published
ChangXin Memory is the only Chinese DRAM maker to complete its production facility. Its competitor, Tsinghua, is years away from production.
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