IBM launched access to its five-qubit universal quantum computer to give students and developers an opportunity to experiment with building applications for quantum computers.
Movidius announced its Fathom neural compute stick, which can improve the deep learning capabilities of an embedded device by orders of magnitude at less than 1.2W of power.
Google's and Nvidia's commitment to OpenPower architecture may make IBM's Power9 an unexpected success in servers and supercomputers, starting next year.
Energous announced partnership with Pegatron, a "Tier-1" manufacturer from China, that can help it broaden the appeal of its WattUp long-range wireless charging technology.
IBM researchers invented a new chip based on non-volatile memory technologies that could speed up the "training" of artificial intelligence that's based on Deep Neural Networks by 30,000x.
ARM and TSMC announced a multi-year collaboration to develop 7nm chips, which may arrive even before Intel's own 7nm chips, sometime in 2019.
Russian company T-Platforms announced the Tavolga Terminal TB-T22BT all-in-one PC powered by the MIPS-based Baikal-T1 chip and running the Debian 8 Linux operating system.
ARM announced the new Cortex-A32 CPU core, which the company claimed is the smallest and lowest-power processor that targets wearables, IoT, and other embedded devices.
MediaTek announced a new mid-range chip, called the helio P20, which is built on a TSMC's 16FF+ process and supports LPDDR4X RAM and cameras with dual-phase detection autofocus.
NXP announces the new LS1012A 64-bit processor for IoT, which includes an 800 MHz CPU, multiple peripherals, built-in security features, and support for open source firmware such as OpenWrt.
MediaTek partners with two major wireless operators, Docomo and Orange, to develop 5G technologies and IoT technologies together.
ARM announced its next-generation real-time processor, the Cortex-R8, which will power LTE-Advanced Pro and 5G modems, as well as future storage products.
Samsung's latest Exynos 7 Octa 7870 is the industry's first mid-range chip built on a 14nm FinFET process with eight 1.6 GHz Cortex-A53 cores and Cat. 6 LTE.
Qualcomm announced three new mid-range chips, the Snapdragon 425, 435 and 625, as well as a gigabit LTE modem, the Qualcomm X16.
Starting with Skylake, Intel opted to remove support for its Xeon processors on consumer-oriented chipsets and instead created two new chipsets, the C232 and C236.
Samsung announced the mass production of chips that use the company's next-generation 14nm Low-Power Plus process technology.