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Latest News

SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming
By Anton Shilov published
No, HBF will not replace DRAM.

AMD prepping new X3D chip with higher clock speeds
By Kunal Khullar published
AMD’s unreleased Ryzen 7 9700X3D appears on PassMark, hinting at a lower-cost alternative to the 9800X3D for gamers.

Vectrex Mini retro console shatters Kickstarter goal within minutes
By Mark Tyson published
The Vectrex Mini vector retrogaming console blasted past its €100,000 funding goal within just 15 minutes

Google exploring putting AI data centers in space
By Jowi Morales published
Google is looking into putting AI data centers into orbit, but it still needs to solve a ton of engineering and cost challenges.

Membrane evaporative cooling tech achieves record-breaking results, could be solution for next-generation AI server cooling
By Aaron Klotz published
Membrane evaporative cooling achieved 800 watts of heat flux per square centimeter, and it's not even close to its theoretical performance limit.

Intel LGA 1151 motherboard spotted with a whopping 36 USB ports
By Hassam Nasir published
As Kylo Ren would say, "MORE!"

New non-invasive 3D imaging of semiconductors could 'save chip foundries billions of dollars'
By Mark Tyson published
EuQlid reveals a breakthrough diamond-based quantum sensing device for the non-invasive 3D imaging of semiconductors.

Amazon says its Fastnet armored undersea cable can stream 12.5 million HD films simultaneously
By Bruno Ferreira published
Amazon's Fastnet 320 Tb/s armored cable connects U.S. and Ireland.
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