Teardown reveals smartphone's key hardware components.
BlackBerry initially refused to discuss the manufacturers behind the internal components of its BlackBerry Z10 smartphone, but a teardown has revealed exactly that.
The BlackBerry Z10 sports a Qualcomm MSM8960 chip manufactured on the 28 nm node with a 1.5 GHz dual-core processor. The chip itself incorporates both 3G and 4G LTE.
It also utilizes two key Samsung components in the form of its 2 GB RAM module and 16 GB of internal flash storage. The full listing of key hardware components in the Z10, which launches in the U.S. during March (or you can grab a unit right now for $999), can be seen below.
- Samsung K3PE0E000A - Multichip Memory - 2 GB Mobile DDR2 SDRAM
- Samsung KLMAG2GE4A - Multichip Memory - 16 GB MLC NAND Flash, Controller
- Qualcomm MSM8960 - Snapdragon S4 Baseband / Applications Processor
- Qualcomm WCD9310 - Audio Codec
- Qualcomm PM8921 - Power Management IC
- Qualcomm RTR8600 - GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS
- Texas Instruments WL1273L - Single-Chip 802.11a/b/g/n WLAN, Bluetooth, and FM
- TriQuint TQP6M9017 - Dual-Band WLAN Module
- RF Micro Devices RF7252 - CDMA/WCDMA BAND 2 Linear Power Amplifier Module
- RF Micro Devices RF7303 - LTE/UMTS/CDMA BAND 3 Linear Power Amplifier Module
- Inside Secure SECUREAD IC5C633I4- NFC Solution Module
- Avago ACPM-5017 - LTE Band XVII Power Amplifier
- Avago ACPM-7051 - Quad-Band GSM / W-CDMA Bands I & V Power Amplifier
- Sony CXM3582UR - SP10T Antenna Switch
- ST Microelectronics LIS3DH - MEMS Accelerometer
- ST Microelectronics LSM330DLC - 3D Accelerometer & 3D Gyroscope
- Synaptics Clearpad 3203 - Capacitive Touchscreen Controller