In need of some memory for your newly planned system build? Be it air or liquid cooled, OCZ delivers its new line of Flex EX Performance memory – claiming the world’s fastest Air or Liquid cooled DDR2 4GB Kit currently available.
OCZ Technology Group pulled back the curtain on its new Flex EX Series. The new series features extreme speeds which are in high demand by system enthusiasts. The new design has a more compact form factor to allow for better installation and physical orientation to maximize usable space within your case and on or around your motherboard.
These new modules are available in DDR2 and DDR3 configurations while offering OCZ class thermal management designed for stability and performance when used in high-end gaming and overclocked systems. Frequencies up to DDR3-2000 and DDR2-1200 denote some of the fastest memory modules available to date.
As commented by Dr. Michael Schuette, VP of Technology Development at OCZ Technology:
“Memory is the primary storage device of any modem computer system and defines how fast the CPU can access data. Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex EX series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments.”
OCZ claims that the Flex EX thermal management solution allows high-frequency memory to operate with a balance of extreme speeds and low latencies while leaving the effects of high temperatures behind. As most of us are well aware, high temperatures can lower your chances of a successful, stable, overclock. Each Flex EX module features a built in liquid injection system design which originated in the Flex XLC Series. The new series was designed with Air and Liquid cooling in mind, utilizing an all aluminum heat module. Of course, using both solutions at the same time will ultimately provide maximum dissipation.
The following high-end solutions will be initially available: