Intel said to be releasing northbridge packaging and testing orders

Intel is in talks with top packaging and testing houses over outsourcing the back-end production of its northbridge chips, according to industry sources. Advanced Semiconductor Engineering (ASE), Amkor Technology, Silicon Precision Industries (SPIL), and STATS ChipPAC have been named as the packaging and testing houses that the US chip giant is talking to over the northbridge orders that it may release in the second half of this year, the sources said.

More here at DigiTimes.

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