Toshiba America Electronic Components (TAEC) announced at CES 2007 that it is offering a selection of four embedded NAND solutions developed by Toshiba: GB NAND, LBA-NAND, GB MCP and Package-on-Package (PoP). The GB NAND is a single-component solution combining a memory controller with an SD interface, error correction code (ECC), wear-leveling and block management with MLC NAND flash memory.
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