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Latest News

Intel details progress on fabbing 2D transistors a few atoms thick in standard high volume fab production environment — chipmaker outlines 300-mm fab compatible with integration of 2D transistor contacts and gate stacks
By Anton Shilov published
2D materials are getting closer to manufacturability using industry-standard equipment.

Intel installs industry's first commercial High-NA EUV lithography tool
By Anton Shilov published
Sets the stage for 14A process technology.

Anycubic’s ‘Dual’ Resin Printer, Photon P1 is out — Supports double the color, double the material
By Matt Farmer published
The P1 is the latest addition to Anycubic's Photon lineup.

Bernie Sanders calls for halt on AI data center construction
By Jowi Morales published
U.S. Senator Bernie Sanders wants to delay AI data center projects to slow down progress, to ensure that AI will benefit the largest number of people and not just the richest few.

Nearly 7,000 of the world’s 8,808 data centers are built in the wrong climate, analysis find
By Luke James published
Nearly 7,000 of the world’s operational data centers are located in climates that fall outside the temperature range recommended for efficient operation, according to a new analysis.

Enthusiast modder stuffs an entire gaming PC inside a gutted Commodore PET 2001
By Hassam Nasir published
A "retrofit" in the truest sense of the word.

Economic analysis of orbital data centers brings the idea down to Earth
By Bruno Ferreira published
In space, nobody can hear you scream as you sign the cheque.

Devastated PC builder orders DDR5 RAM from Amazon, receives DDR2 and some weights — counterfeit 32GB kit a worrying sign of rising return and sales fraud
By Luke James published
A buyer in Spain has reported receiving a sealed DDR5 memory kit that contained counterfeit parts, raising fresh concerns about return fraud affecting high-value PC components.
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