All Dressed Up, No Time To Go
Here you see the GTX 280 with its copper attachment, ready to dissipate heat to the much colder custom cooling pot.
When Cold Meets Warm...
Condensation halts progress. The MacSafe team was forced to take breaks when condensation got out of hand. Those break were used for additional shopping trips.
A Tad Too Small
Simple and effective solution á la Tom’s Hardware in 2003: copper piping with high-heat conducting properties and insulation to prevent the formation of condensation. However, the mass of the CPU pot was not sufficiently taken into account.
Don't Short It: Condensation Forms
MSI’s P45 board with condensation forming at the CPU socket: here, the MacSafe team had not paid enough attention to the perfect insulation. A waiting period was required in order for the board to dry out.
Setting The Custom Cooling Aside
Felling the need to warm up: the formation of condensation on the copper connection between the CPU pot and the graphics card prompted the team to take yet another break. Had they continued, condensation could have easily led to a short-circuit—an issue the contestants here in the States battled as well.
Consultations between jury and team
Consultations between the Tom’s Hardware Germany jury and the individual teams: here Jürgen Augstein from the MacSafe team is explaining his team’s strategy for constructing an efficient cooling mechanism using liquid nitrogen.