Intel is currently seeking PBGA (plastic ball-grid array) substrate suppliers in Taiwan through its domestic IC packaging and testing contract makers, as the chip giant's major IC substrate suppliers in Japan are shifting more capacity to flip-chip (FC) substrate production, sources at Taiwan IC packaging firms indicated.
Kinsus Interconnect Technology and Phoenix Precision Technology (PPT) are likely to be beneficiaries, the sources noted.
More here at DigiTimes.
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