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SK Hynix raises a record $26.5 billion in historic U.S. IPO
SK hynix raised $26.5 billion in a record-breaking Nasdaq IPO, as it plans to channel the windfall from surging AI demand and sold-out HBM supply to fund new fabs.
Japanese chipmaker Rapidus to offer lower wafer pricing than TSMC — 2nm class silicon to be priced around $20,000 on 2027 launch
Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.
Researchers turn HBM on its side to tackle AI memory’s heat wall
Technologies not yet proven as viable HBM alternatives
Micron lifts U.S. spending to $250 billion
Micron has said it will invest up to $3 billion in the US semiconductor supply chain, with $500 million of that going to GlobalWafers.
Rapidus fab roadmap examined
Premium Rapidus is building Japan's entire return to leading-edge logic on one fab in Chitose, Hokkaido.
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
China’s Huawei to enter South Korean AI chip market with new Atlas SuperPods, clusters pack 8,192 Ascend 950 accelerators per deployment
The company claims its Ascend 950PR delivers approximately 2.87 times the inference performance of Nvidia's H20
Intel 18A wafer-to-wafer yield issues fixed, report claims
Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.
Intel expands production of photomasks in California: EUV and High-NA EUV in the focal point
Intel begins expansion of its Bowers Campus in Santa Clara to produce more photomasks in-house, which is set to be crucial as process technologies get more sophisticated.
Tesla hires 17-year Intel veteran responsible for billion-dollar fab startups — Gary Jiang likely chosen to oversee fab efforts for Terafab's licensing of 14A
Tesla hires an Intel veteran, who most recently was responsible for installing advanced tools at Intel's Arizona fab that is now ramping production of chips using 18A fabrication process.