Latest about HBM3E
The company has plans to demo its next-gen 16-layer HBM3E prototype alongside a high-capacity enterprise SSD, and new solutions to improve AI performance
Micron to expand HBM3E and HBM4 output when its HBM assembly facility in Singapore start operations in 2026.
In an industry-first, SK hynix has announced its 16-Hi HBM3E memory, offering capacities of 48GB per stack alongside other bleeding-edge NAND/DRAM products.
SK hynix kicks off mass production of 12-Hi HBM3E for AMD's MI 325X, Nvidia's Blackwell Ultra, other high-performance processors.
Nikkei says that Micron is set to produce more HBM3E memory in Taiwan, expand R&D operations in the U.S. and even start producing HBM3E memory in Malaysia.
In a recent discussion with reporters, Nvidia's CEO Jensen Huang said the GPU maker is still working on certification for Samsung's most advanced HBM chips for AI use.
Samsung states its HBM3E memory works with processors from various vendors.
Samsung's HBM3E reportedly consumes too much power and overheats, so Nvidia does not plan to use them for now.
