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DRAM makers may potentially get more money for their wafers than TSMC gets for its N3 wafers.
The rush to build semiconductor plants in the U.S. is fueling the demand for engineers and technicians.
This could potentially be the first HBM manufacturing plant in the U.S.
SK hynix breaks ground on HBM assembly plant in the U.S. that will form a connection between DRAM wafers produced in South Korea and their consumers among AI companies in the U.S.
Premium OXMIQ presented its High Bandwidth Flash (HBF) use-case scenarios at Hot Chips 2026, which dramatically narrow the circumstances under which HBF makes sense.
Premium The problem, per SK, is that HBM cubes are capped at a total thickness of 775 microns, the standard thickness of a 300mm logic wafer.
The increases will take effect on Grace Blackwell and Vera Rubin systems shipping early next year.
