G.Skill launches new 256GB memory kits.
China-based company ChangXin Memory Technologies has started to mass produce its homemade DRAM chips.
Understanding memory is more than just about capacity and speed. We’ll walk you through what you need to know about timings/latency, ranks and more.
G.Skill has teased its 8x 8GB Trident Z Royal kits that won't be available until at least next month.
YMTC has started volume production of its first 3D NAND process. It manufactures the 64-layer, 256Gb TLC dies with its Xtacking technology for putting the CMOS under the NAND array.
Is Ryzen 3000 optimized for DDR4-3200? What if we want more? We examine everything from frequency to rank count to nail down optimal settings.
We saw interesting results with a recent memory review, so we dig a bit deeper. Does the motherboard maker really impact memory compatibility and performance?
Micron opened its latest 3D NAND Fab 10 expansion in Singapore last week. The expansion will support the companies' 96-layer and beyond process nodes.
DRAMeXchange said DRAM prices fell nearly 10% in 2Q19 as supply continued to outpace demand, but NAND prices remained flat, thanks to a Toshiba power outage.
Micron announced that it had begun volume production of 1z nm 16Gb DDR4 RAM products, a first in the industry.
TSMC's first blog post states that Moore's Law is not dead, with N5P as its latest node. The company also talks up its advanced packaging techniques with a huge interposer.
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