Globalfoundries said that it plans to take on 32nm orders by third party customers in Q4 2009.
Globalfoundries, AMD's manufacturing spinoff, is taking the "downsizing" to the next level by obtaining bulk 32nm process technology this year, and plans to take third-party orders by Q4 2009/Q1 2010. If the company can get the ball rolling, the 32nm processing will make it extremely competitive against other large contract makers including United Microelectronics and Taiwan Semiconductor Manufacturing (currently working on manufacturing 32nm processing as well).
“Globalfoundries is entering the foundry market at the right time and with the right business model to change the landscape of the industry. More importantly, we’re entering the industry with the right mindset and resources. Our investments in leading edge technology and in supporting infrastructure will ensure the success of our customers,” said vice president of sales and marketing Jim Kupec. [PC Watch, via X-bit]
The company said that it wants to beef up overall output. For now, Globalfoundries has Fab 1 manufacturing capabilities--AMD's Fab 36 and Fab 38 leftovers--using 45nm processing, spitting out a total monthly output of 25 thousand 300mm wafers between the plants located in Germany and Dresden. However, the company plans to bring a new Fab 2 foundry online--located in Saratoga County, New York--that will generate up to 35 thousand wafers a month by 2012.
Last year, IBM successfully produced the first experimental SRAM chips using 32nm process technology. Globalfoundries and other IMB partners are expected to produce the 32nm chips by Q1 2010. Hopefully, Globalfoundries will get everything into place to produce 32nm chips before competitor Taiwan Semiconductor Manufacturing gets its 32nm chips out the door fist.
“Despite the current economic climate, this is an industry with tremendous opportunities for long-term growth and innovation,” said Waleed Al Mokarrab, Chairman, ATIC. “Through its global footprint, world-class technology know-how and access to state-of-the-art research and development, we believe Globalfoundries is well-positioned to challenge for market leadership in this competitive industry."
AMD said that it will continue to play a critical role in Globalfoundries’ future success as its shareholder and also as its first and largest customer.
Umm, Dresden is in Germany.
plus, in the fourth paragraph ( Globalfoundries and other IMB partners are expected to produce the 32nm chips by Q1 2010. ) can you just write IBM instead of IMB
Umm, Dresden is in Germany.
Here is the interview. First of all we are talking about bulk, not SOI. So this is interesting for GPUs but not CPUs. Next, they say
Their can be a huge difference between "entering production" and mass production. Giving that formulation the HD5xxx-cards should be TSMC again, but that will be interesting to watch.
As some German guy I can guarantee you that Dresden is in Germany
damn... stock clock of 4GHZ @1.2V
i'll take one
I think that you will get better performance if you use 2 (dual) cores, not have 2 cores dueling with each other. It wastes lots of cycles.
The 32nm production mentioned here is the bare Si process which will be a lower performance process and will not be making CPU's. When the foundry gets around to 32nm SOI (late 2010/12011) then that will mean 32nm CPU's.
Also your quote on the NY fab is ALSO WRONG. At FULL CAPACITY/BUILDOUT it will be capable of ~30-35K wafers/month, BUT NOT IN 2012! (Hint - look at AMD's own analyst day foils)
Is there anything in this article the author managed to get right?