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Encapsulation

Semiconductor Production 101
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Most processors are encapsulated into a plastic package with a heat spreader today.

Typically, a die is encapsulated into a ceramic or plastic package to prevent damage. Modern processors also carry a so-called heat spreader, which offers protection as well as a larger contact surface for your processor cooler.

Test & Burn-In

The last step comprises another testing and burn-in process, which is performed at increased temperatures according to the processor specification. A material handling solution picks the processors up and positions them, so it interfaces with a test socket. The testing equipment then performs an analysis of all the functions.

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