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DeepCool Gives Birth to Gabriel CPU Cooler

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Gabriel is born to cool CPUs!

DeepCool has announced a new CPU cooler that will be named 'Gabriel.' It is a low profile CPU cooler, and thus intended for more cramped enclosures. As the image from the press release indicates, it is for use in smaller systems.

Gabriel features a 120 mm fan that can spin at speeds ranging from 900 RPM to twice that. At 1800 RPM it'll make no more than 32.4 dBA of noise. In it's entirety, the cooler weighs around 426 grams. The combination of everything gives Gabriel the power to cool down CPUs with TDPs of up to 100 W.

The entity will have support for most modern CPU sockets, including AMD's FM2 and AM3+ sockets, as well as Intel's new LGA1150 socket. Gabriel will be available for purchase starting in November, though no price tag was given.

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7 Comments Comment from the forums
  • kunwho 17 October 2013 04:55
    They should design that the CPU is mounted on underside of the motherboard and the fan as a motherboard tray.
    Reply
  • onover 17 October 2013 07:29
    11736097 said:
    They should design that the CPU is mounted on underside of the motherboard and the fan as a motherboard tray.

    What the ... how would that work?!
    1. How would you mount the motherboard onto a fan? Yes, you could probably put certain standoff holes in the fan case but it would be way too flimsy to support a motherboard and all the components.
    2. The motherboard would block the airflow. It's basically like having a normal desk fan and holding a large piece of cardboard directly in front of it. Useless.
    Reply
  • ShadyHamster 17 October 2013 10:47
    11736777 said:
    11736097 said:
    They should design that the CPU is mounted on underside of the motherboard and the fan as a motherboard tray.

    What the ... how would that work?!
    1. How would you mount the motherboard onto a fan? Yes, you could probably put certain standoff holes in the fan case but it would be way too flimsy to support a motherboard and all the components.
    2. The motherboard would block the airflow. It's basically like having a normal desk fan and holding a large piece of cardboard directly in front of it. Useless.

    I laughed a little.

    Reply
  • ap3x 17 October 2013 13:24
    Who thought putting a huge add in the middle of an article was a good idea. They should be fired.
    Reply
  • Yuka 17 October 2013 14:09
    11736777 said:
    11736097 said:
    They should design that the CPU is mounted on underside of the motherboard and the fan as a motherboard tray.

    What the ... how would that work?!
    1. How would you mount the motherboard onto a fan? Yes, you could probably put certain standoff holes in the fan case but it would be way too flimsy to support a motherboard and all the components.
    2. The motherboard would block the airflow. It's basically like having a normal desk fan and holding a large piece of cardboard directly in front of it. Useless.

    Heatpipes to the back. You can leave holes and have an HSF that you can assemble to pass heatpipes to the back of the board.

    I won't be a whole solution by itself, but could help in the cooling process for keeping a low profile HSF. Now, I don't think ITX FF can leave holes intentionally in their design, haha.

    And in regards to the news... I wonder how it compares to the Gemin II M4. I have that for my A8 3850 inside an HTPC case and it works amazing.

    Cheers!
    Reply
  • Eximo 17 October 2013 20:14
    Hmm, an interesting concept I could see. Much like the recent GPU cooler with 5 small fans pulling from the edge of the card. A BGA based board on the same concept with the heat sink/cpu underneath and air flowing from one side of the case to the other would be interesting. Motherboard could even be mounted upside down so the peripherals hang and the heatsink would end up on the top. Though it would have to have a case to match.

    Some of the OEM ITX boards have similar pass through cooling. One fan in, one fan out, tunnel that goes over the VRM and through the CPU heatsink.
    Reply
  • goodguy713 30 October 2013 22:59
    a much better solution would be to actually have the case act as a heat sink and make it a two piece latching system so you could still get to your parts. having the cover vetted with aluminum and copper piping maximized by 120mm case fans pulling air through the paneling and venting it through the top I could see some interesting designs based on that. as for the other guys flipping the socket and making the back plate act as a heat sink that would only work with this method. the challenge would be getting a suitable locking mechanisim so it would still be a capable heat conductor possibly silver plating ?
    Reply