Sources claim Samsung to establish BGA substrate plant in Suzhou

News
By published

Samsung Electro-Mechanics will start volume shipping ball-grid array (BGA) substrate from a plant in Suzhou starting in mid 2006 for packaging Samsung DDR2 memory, according to industry sources. Local BGA substrate makers are not concerned about Samsung's supposed move, claiming the potential impact would be limited.

More here at DigiTimes.

TOPICS
Wolfgang Gruener
Wolfgang Gruener
Contributor

Wolfgang Gruener is an experienced professional in digital strategy and content, specializing in web strategy, content architecture, user experience, and applying AI in content operations within the insurtech industry. His previous roles include Director, Digital Strategy and Content Experience at American Eagle, Managing Editor at TG Daily, and contributing to publications like Tom's Guide and Tom's Hardware.