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Researchers Are Bending Memory for IoT Products
By Francisco Pires published
A team of researchers with Stanford University have developed flexible, bendable memory based on phase-change materials.
Phison Announces Entrance Onto PCIe 5.0 Redriver Market
By Francisco Pires published
Phison today has announced the development and early-2022 release of its PS7101 PCIe 5.0 redrivers, motherboard-bound integrated circuits that aim to counteract electrical signal loss and crosstalk.
TSMC Exploring On-Chip, Semiconductor-Integrated Watercooling
By Francisco Pires published
TSMC is in the process of testing and designing water cooling delivery straight to the heart of your future chips - a mandatory exploration in wake of vertically-integrated silicon.
Fake Chips Proliferating in China Market, Spreading Overseas: Report
By Anton Shilov published
A flood of fake chips and components hits China and could spread to other countries.
JLCPCB Make It Easier To Build Your Own RP2040 Boards
By Les Pounder published
JCLPCB announce that the RP2040 SoC is now available to add to your PCB project and they will even solder it for you.
China to Ramp Up High-Volume Production Using 14nm Node by End of 2022
By Anton Shilov published
Chinese officials expect local semiconductor industry to adopt 14 nm for high-volume applications by end of 2022.
China Has Made a Record 140 Billion Chips So Far This Year
By Anton Shilov published
China's semiconductor output hit a new high last month with a wave of new chip companies.
DRAM Alternative Developed: 4X Higher Density at Higher Speed and Lower Power
By Anton Shilov published
Startup wants to revolutionize commodity memory market with dynamic flash memory
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