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Features archive

October 2026

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9 articles

October 23
- China can make advanced chips without EUV, but the bill keeps growing — DUV multiple patterning means bigger dies, lower yields, and longer manufacturing times
October 22
- LTO roadmap extends to 365 TB per cartridge as tape storage refuses to die — 25-year-old format sees 400x capacity increase without changing form factor
October 21
- Why you don't need an audiophile headset for gaming — comfort, convenience, and a good mic win over pure audio fidelity
October 15
- The internet isn’t the best place to find upgrades for your computer — brick-and-mortar stores still reign supreme thanks to bundled deals
October 14
- Analyzing Intel's EMIB and Foveros advanced packaging roadmaps — how Intel plans to scale chips in every direction
October 12
- Meet the modders porting ringfenced DLSS features to older GPUs — how DLSS 5 and Multi-Frame Generation were unlocked for older architectures
October 8
- Software could be the easiest fix for hyperscalers' AI power squeeze, researchers say — data center demand is expected to rival Japan's electricity usage by 2030
October 6
- Black Friday laptop deals: What should small and medium-sized businesses be looking for?
October 1
- AI's chipmaking frontier may face patent infringement hurdles as autonomous tools take over — 'AI can spread a copied design or infringed patent across thousands of chips before anyone notices,' says expert

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