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PBGA substrate shortage may disrupt SiS and VIA chipset shipments

Because supplies of plastic ball-grid array (PBGA) substrates will continue to be short of demand throughout the end of this year, Taiwan chipset makers Silicon Integrated Systems (SiS) and VIA Technologies may face difficulties in fulfilling large entry-level chipset orders in the third quarter, according to sources in the Taiwan substrate industry.

More here at DigiTimes.