PBGA substrate shortage may disrupt SiS and VIA chipset shipments

News
By published

Because supplies of plastic ball-grid array (PBGA) substrates will continue to be short of demand throughout the end of this year, Taiwan chipset makers Silicon Integrated Systems (SiS) and VIA Technologies may face difficulties in fulfilling large entry-level chipset orders in the third quarter, according to sources in the Taiwan substrate industry.

More here at DigiTimes.

See more Motherboards News
Wolfgang Gruener
Wolfgang Gruener
Contributor

Wolfgang Gruener is an experienced professional in digital strategy and content, specializing in web strategy, content architecture, user experience, and applying AI in content operations within the insurtech industry. His previous roles include Director, Digital Strategy and Content Experience at American Eagle, Managing Editor at TG Daily, and contributing to publications like Tom's Guide and Tom's Hardware.