TSMC's 28nm Technology Now in Volume Production
TSMC's 28-nm processing is now officially open for business.
Monday Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest dedicated semiconductor foundry, said that its 28-nm process is now in volume production, and that production wafers have already been shipped to customers.
According to the company, the new process includes 28-nm High Performance (28HP), 28-nm High Performance Low Power (28HPL) and 28-nm Low Power (28LP) which are in volume production now. It also includes 28-nm High Performance Mobile Computing (28HPM) which will be ready for production by the end of this year.
Monday TSMC said that the number of customer 28-nm production tape outs has more than doubled as compared with that of 40-nm, residing at more than 80 tape-outs so far. "The TSMC 28-nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers," the company stated in a press release.
"We applaud TSMC’s success bringing a robust 28nm process to market, and we look forward to leveraging the benefits of this new process when we ship our next-generation discrete graphics products," said Matt Skynner, Corporate Vice President and General Manager, GPU Division, AMD. "The combination of AMD’s industry-leading graphics IP and TSMC’s manufacturing prowess will enable the next big leap in graphics performance with the parallel compute horsepower and power efficiency designed to meet the needs of even the most demanding gamer."
TSMC's 28-nm design ecosystem is now available through its Open Innovation Platform, with qualified EDA design tools and third-party IP ready for customer designs, the company said.

+1 to above comment
No the only way I see physical improvements happening in the future is if big chip companies start funding more research into alternative processing methods like quantum computers and coming up with ways to represent data in more than just 0's and 1's. I know I might be far fetching this a bit but something somewhere at sometime is going to have to change dramatically or otherwise technological advances like we have seen in the past 10-15 years is going to slow to a mere crawl in the next 10-15 years in the computer segment.
this meand the new 7xxx and 6xx gpus are well on track. i am hoping for a timely release for 7xxx in december
Why would AMD chose a bulk process it's CPUs? GloFo's 32nm SOI process packs transistors as close TSMC's 28nm bulk process and while being similar to the high performance type has a power consumption per transistor similar to the low power type from TSMC.
You're really comparing apple produce to Apple products here, ie. it's completely different things entirely.
No its actually pretty much the same. AMD went with GoFlo because that's who they have a business deal with. With the recent low yields and productions problems they may be changing business partners.
TSMC is an old company who has a pretty solid history, they churn out alot of chips every year, chips that go inside pretty much every electronic device on the planet.
That is why someone would want to go with them, you know your product will get made, made the way you want it and made in the quantity you need.
No the only way I see physical improvements happening in the future is if big chip companies start funding more research into alternative processing methods like quantum computers and coming up with ways to represent data in more than just 0's and 1's. I know I might be far fetching this a bit but something somewhere at sometime is going to have to change dramatically or otherwise technological advances like we have seen in the past 10-15 years is going to slow to a mere crawl in the next 10-15 years in the computer segment.
3D chip stacking is what Samsung's going for now.
http://www.samsung.com/us/news/newsRead.do?news_seq=19766&page=1&gltype=globalnews
Currently chips are etched on several silicon wafers and layered ontop of each other. Going to a more dense 3D design would dramatically increase the amount of space available and reduce the power usage, but would also make heat dissipation a critical concern.
http://chipdesignmag.com/lpd/blog/2011/10/06/samsung-micron-unveil-3d-stacked-memory-and-logic/