TSMC's 28nm Technology Now in Volume Production
TSMC's 28-nm processing is now officially open for business.
Monday Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest dedicated semiconductor foundry, said that its 28-nm process is now in volume production, and that production wafers have already been shipped to customers.
According to the company, the new process includes 28-nm High Performance (28HP), 28-nm High Performance Low Power (28HPL) and 28-nm Low Power (28LP) which are in volume production now. It also includes 28-nm High Performance Mobile Computing (28HPM) which will be ready for production by the end of this year.
Monday TSMC said that the number of customer 28-nm production tape outs has more than doubled as compared with that of 40-nm, residing at more than 80 tape-outs so far. "The TSMC 28-nm process has surpassed the previous generation’s production ramps and product yield at the same point in time due to closer and earlier collaboration with customers," the company stated in a press release.
"We applaud TSMC’s success bringing a robust 28nm process to market, and we look forward to leveraging the benefits of this new process when we ship our next-generation discrete graphics products," said Matt Skynner, Corporate Vice President and General Manager, GPU Division, AMD. "The combination of AMD’s industry-leading graphics IP and TSMC’s manufacturing prowess will enable the next big leap in graphics performance with the parallel compute horsepower and power efficiency designed to meet the needs of even the most demanding gamer."
TSMC's 28-nm design ecosystem is now available through its Open Innovation Platform, with qualified EDA design tools and third-party IP ready for customer designs, the company said.
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YESSSSSSSSSSSSSSSSSSSS!!!
cant they also fab AMD's CPU's??
I would love a new card before the new year
Hopefully this means that the 7xxx series won't be delayed.
12 more nanometres until QT takes effect. Can't wait to see where we go with this!
"cant they also fab AMD's CPU's??"
+1 to above comment
This is the one weve all been waiting for, cant wait
Does this tie in with AMD's plans to move onto 28nm next year? Yes, I think so.
AMD may switch form GF to TSMC of there CPU manufacturing.............
good news
please give us the hd7000 and i hope GCN is impressive .
Hopefully they apply that to bulldozer's 2nd gen or something ^_^ but sounding good so far either way.
This is great news indeed. It's time I start saving up for a new computer, hopefully this drops some prices for when I'm ready.
SNB-E release next month + 7970 release by year's end = happiness explosion
SNB-E release next month + 7970 release by year's end = happiness explosion
hell yeah im finally going to upgrade my phenom Ii 940 by this year hopefully
Maybe Amd can get a product out on time now.
Big deal. I'd say too years too late.
Anyway most of the mobile crap runs at 45 nm, 65 nm anyway.
The only company that seems to care about using the latest tech is Intel because of their crappy, ancient x86 architecture. And they don't have many other means of improving the performance other then using smaller and smaller transistors.
This is the one weve all been waiting for, cant wait
You will continue waiting. They have the production working now but the clients are reluctant to start ordering. Blame it on the economy. At least there are lots of reports. Probably will see a bigger amount of 28 nm based products in 1-2-3 years.
So at current rate I believe the foundries are close to churning out a new smaller manufacturing process about every two years or a little more given that once a manufacturing node comes along they are already planning the next one. What I want to see what they plan to do when they can no longer physically make chips and such any smaller due to too much loss due to QT and the like. I mean there has been talks of different computing methods such as quantum computing but the only working prototype is still just a glimmer in the eye of engineers who are developing it. The only way I see future processors improving is through architecture design changes and not so much being able to fit more transistors in a given die size. However I do see there being alot of improvement if software, and I mean ALL software could take advantage of true parallel processing to use every last transistor to get work done. But we all know that isnt going to happen because hardware has always been far ahead of software and most likely always will unless something dramatic changes.
No the only way I see physical improvements happening in the future is if big chip companies start funding more research into alternative processing methods like quantum computers and coming up with ways to represent data in more than just 0's and 1's. I know I might be far fetching this a bit but something somewhere at sometime is going to have to change dramatically or otherwise technological advances like we have seen in the past 10-15 years is going to slow to a mere crawl in the next 10-15 years in the computer segment.
global foundries could learn something from tsmc.
this meand the new 7xxx and 6xx gpus are well on track. i am hoping for a timely release for 7xxx in december
cant they also fab AMD's CPU's??
Why would AMD chose a bulk process it's CPUs? GloFo's 32nm SOI process packs transistors as close TSMC's 28nm bulk process and while being similar to the high performance type has a power consumption per transistor similar to the low power type from TSMC.
You're really comparing apple produce to Apple products here, ie. it's completely different things entirely.
Why would AMD chose a bulk process it's CPUs? GloFo's 32nm SOI process packs transistors as close TSMC's 28nm bulk process and while being similar to the high performance type has a power consumption per transistor similar to the low power type from TSMC.You're really comparing apple produce to Apple products here, ie. it's completely different things entirely.
No its actually pretty much the same. AMD went with GoFlo because that's who they have a business deal with. With the recent low yields and productions problems they may be changing business partners.
TSMC is an old company who has a pretty solid history, they churn out alot of chips every year, chips that go inside pretty much every electronic device on the planet.
That is why someone would want to go with them, you know your product will get made, made the way you want it and made in the quantity you need.
So at current rate I believe the foundries are close to churning out a new smaller manufacturing process about every two years or a little more given that once a manufacturing node comes along they are already planning the next one. What I want to see what they plan to do when they can no longer physically make chips and such any smaller due to too much loss due to QT and the like. I mean there has been talks of different computing methods such as quantum computing but the only working prototype is still just a glimmer in the eye of engineers who are developing it. The only way I see future processors improving is through architecture design changes and not so much being able to fit more transistors in a given die size. However I do see there being alot of improvement if software, and I mean ALL software could take advantage of true parallel processing to use every last transistor to get work done. But we all know that isnt going to happen because hardware has always been far ahead of software and most likely always will unless something dramatic changes.
No the only way I see physical improvements happening in the future is if big chip companies start funding more research into alternative processing methods like quantum computers and coming up with ways to represent data in more than just 0's and 1's. I know I might be far fetching this a bit but something somewhere at sometime is going to have to change dramatically or otherwise technological advances like we have seen in the past 10-15 years is going to slow to a mere crawl in the next 10-15 years in the computer segment.
3D chip stacking is what Samsung's going for now.
http://www.samsung.com/us/news/new [...] globalnews
Currently chips are etched on several silicon wafers and layered ontop of each other. Going to a more dense 3D design would dramatically increase the amount of space available and reduce the power usage, but would also make heat dissipation a critical concern.
http://chipdesignmag.com/lpd/blog/ [...] and-logic/
They will also be manufacturing for the AMD Piledriver.
Once GloFo have finished their NY fab, AMD will be in a far better position to meet demand.
Why would AMD chose a bulk process it's CPUs? GloFo's 32nm SOI process packs transistors as close TSMC's 28nm bulk process and while being similar to the high performance type has a power consumption per transistor similar to the low power type from TSMC.You're really comparing apple produce to Apple products here, ie. it's completely different things entirely.
Oh thanks for the clarification.
Once GloFo have finished their NY fab, AMD will be in a far better position to meet demand.
There is no problem meeting demand as many AMD users have jump to Intel since Bulldozer... well, sucked.
AMD went with GoFlo because that's who they have a business deal with.
Uhm, I think you're forgetting that one of TMSCs primary costumers are AMD and their Radeon GPUs. AMD has very solid engeneering reasons behind going with GloFo's more advanced SOI process.
It should be noted that TMSC expect to shift to the SOI process as well at the 20nm node. More specifically the FD-SOI process which will be similar to Intels possible future 14nm FinFet technology in performance and transistor packing density
AMD can't switch their CPU process that quickly. They would have to do a completely new tape out. It's not like you can take the same masks from GF and just pass them off to TSMC. They have different standard cell libraries and you're looking at a significant NRE and redesign.
Good, now AMD can depend on their successful GPU division to keep them afloat after the not so good performance of Bulldozer.
do you think the HPL or HPM TSMC 28nm process could surprisingly use SOI to reduce AMD's glofo dependance ?
I think if and only if developers starting optimizing some of their code for bulldozer, then it'll be the superior chip. but with intel's strangle hold on the industry, that's not likely to happen, and developers won't spend resources to write bulldozer specific code.